Qualcomm and Himax Announce 3D Depth Sensing Technology

Two technology companies have announced a partnership to develop and commercialise a high resolution, lower-power 3D depth sensing solution designed for applications such as 3D reconstruction, scene perception for mobile devices and virtual reality (vr) and augmented reality (AR) technologies.

The collaboration allows Qualcomm Spectra technology and its knowledge of technologies such as computer vision architecture to be combined with Himax’s 3D camera module, called SliM. Qualcomm and Himax will be working together to further develop the SliM technology for a variety of applications and markets.

“This partnership with Himax highlights the technology investments we are making with Taiwanese companies to continue leading in visual processing innovation,” said Jim Cathey, senior vice president and president, Asia Pacific and India, Qualcomm Technologies, Inc. “The combination of cutting edge technology licensing and collaboration with an industry leading Taiwanese partner like Himax will help create groundbreaking new products in Taiwan, strengthening the global 3D depth sensing ecosystem and boosting Taiwan’s economy.”

“Our 3D sensing solution will be a game changing technology for smartphones, where we will enable the Android ecosystem to provide the next generation of mobile user experience,” said Jordan Wu, President and Chief Executive Officer of Himax Technologies. “Our two companies have worked together for more than four years to design the SLiM™ 3D sensing solution to meet growing demands for enhanced computer vision capabilities that will enable amazing new features and use cases in a broad range of markets and applications. We are pleased to partner with Qualcomm Technologies to put together an ecosystem and to enable the revolutionary computer vision solutions for our customers globally in a timely fashion.”

VRFocus will bring you further news on VR/AR applications for this technology as it becomes available.